Archived posting to the Leica Users Group, 2008/05/11

[Author Prev] [Author Next] [Thread Prev] [Thread Next] [Author Index] [Topic Index] [Home] [Search]

Subject: [Leica] Leica R-10 at Photokina 2008
From: red735i at earthlink.net (Frank Filippone)
Date: Sun May 11 06:23:07 2008
References: <A814E954-BC86-4F5A-A5FF-BBD885880DD3@comcast.net> <C44BFF55.AAF47%mark@rabinergroup.com>

In general, no.  When you cut a wafer, you first apply a thin sheet of
plastic wrap to the top surface.  After cutting, the thin plastic keeps all
the chips in the same orientation as you started, so you can sort out the
good ones from the bad ones.  If you use a laser or a plasma cutter, it
would be difficult to cut through the wafer, and not the plastic as well.

Frank Filippone
red735i@earthlink.net



> Hexagons!
> 
> Do they really use a saw these days, or a cnc cutter that could easily
> cut any shape they want?
> 
> Tom
> 
Would they not use "LASER" beams!?


Mark William Rabiner




In reply to: Message from tomschofield at comcast.net (Tom Schofield) ([Leica] Leica R-10 at Photokina 2008)
Message from mark at rabinergroup.com (Mark Rabiner) ([Leica] Leica R-10 at Photokina 2008)