Archived posting to the Leica Users Group, 2008/05/11
[Author Prev] [Author Next] [Thread Prev] [Thread Next] [Author Index] [Topic Index] [Home] [Search]In general, no. When you cut a wafer, you first apply a thin sheet of plastic wrap to the top surface. After cutting, the thin plastic keeps all the chips in the same orientation as you started, so you can sort out the good ones from the bad ones. If you use a laser or a plasma cutter, it would be difficult to cut through the wafer, and not the plastic as well. Frank Filippone red735i@earthlink.net > Hexagons! > > Do they really use a saw these days, or a cnc cutter that could easily > cut any shape they want? > > Tom > Would they not use "LASER" beams!? Mark William Rabiner