Archived posting to the Leica Users Group, 2003/06/25
[Author Prev] [Author Next] [Thread Prev] [Thread Next] [Author Index] [Topic Index] [Home] [Search]On 2003-06-25 jerryleh@pacbell.net (Jerry Lehrer) thoughtfully wrote: >Sound almost like Boeing announcing a plane that they will, >may, might be, won't be building. > >Jerry Clearly you haven't been following Boeing over the past couple of years - - they have been doing exactly that with the 747x and the Sonic Cruiser. Just showing they have a clear view of a product and how it will be engineered is useful. I would hope they would be able to meet a better spec - but then I have no/zip/zero idea of the lead time between the software needed to service the chip and the attendant support hardware. But Austin and Brian could probably tell us: can you design the softare/hardware system in an appropriate manner so the chip becomes a RELATIVELY easy thing to change? I have a bad feeling that the whole thing is in concert and that surrounding hardware/software is co-mingled in some devious way that will make it difficult to change the chip without massive changes in other places. It would be nice if the sensor platform itself were engineered to be replaceable so that when new/better chips were introduced that they could be upgraded but I don't think there's a defined buss structure for the chips. Now I have to deal with my solar hot-water system melt-down. Sigh. Later Adam - -- To unsubscribe, see http://mejac.palo-alto.ca.us/leica-users/unsub.html